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  • High purity aluminum rotary target, 122mm inner diameter
  • High purity aluminum rotary sputtering target tube, 4N to 5N
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High Purity Aluminum

High Purity Aluminum Rotary Targets (Tubes)

High Purity Aluminum - Tubes| SKU: varies by variant
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$5,500.00 USD
$5,500.00 USD
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GDMS COA included with each shipment. Most standard items ship within 1 to 2 business days.

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High purity aluminum rotary targets (tubes) are cylindrical sputtering sources designed for large-area magnetron sputtering systems. The tubular geometry provides uniform erosion across the target surface, significantly higher material utilization, and extended operational life compared to planar targets, resulting in reduced downtime and lower cost of ownership in high-volume production environments.

Available in purities from 4N (99.99%) to 5N (99.999%), these rotary targets deliver consistent, low-contamination performance for demanding thin film processes. Custom lengths, diameters, wall thicknesses, and backing tube bonding options are available to accommodate specific deposition equipment and process requirements. GDMS COA included with each shipment.

Rotary targets are typically produced to order. Lead times vary depending on specifications and current workload. Please contact us for current availability and delivery estimates.

Standard Size 
4.8” (122 mm) ID / 6.7” (170 mm) OD, up to 112” (2,844 mm) length (unfinished ends)

*It is possible to machine the standard size ID/OD - 122 mm/170 mm to narrower tube thickness at an additional charge. 

Typical Applications:
•    Semiconductor wafer processing
•    Flat panel display and touch screen coatings
•    Architectural glass and large-area optical coatings
•    Solar cell and photovoltaic manufacturing
•    Industrial-scale thin film production
•    Aerospace and automotive component coatings

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Typical Applications

  • Semiconductor metallization and interconnect layers
  • Flat panel display and touch screen coatings
  • Optical coatings and precision mirrors
  • Hard disk drive media
  • Solar cell contacts
  • MEMS and sensor device fabrication
  • Decorative and functional PVD coatings
MaterialAluminum (Al)
Purity range4N (99.99%) to 6N (99.9999%)
Alloy optionsAlSi, AlCu, AlCuSi, AlMg, AlMgSi, AlNi, AlNd
Available diameters1" (25mm) to 12" (305mm)
Available thicknesses0.125" (3.2mm) to 1" (25.4mm)
Production methodDirectional solidification in vacuum (5N and above). Cast (4N).
FormsDisk, bonded assemblies, custom shapes
CertificationGDMS COA included with each shipment
Shipping1 to 2 business days (standard US), 2 to 5 days international
Custom ordersCustom sizes, thicknesses, alloys, and bonded assemblies available
What purity sputtering target do I need for semiconductor applications?
For semiconductor metallization and interconnect layers, 5N (99.999%) is the standard choice. For higher-end applications such as superconducting devices or quantum computing, 6N (99.9999%) targets reduce trace metal contamination to levels required by those processes. 4N targets are suitable for general thin-film coating and decorative applications.
Can I get a bonded sputtering target assembly?
Yes. HPA supplies bonded target assemblies designed to match your specific sputtering tool and process requirements. Contact us with your target design, backing plate specifications, and bonding requirements for a custom quote.
What is the difference between cast and directionally solidified targets?
HPA's super high purity targets (5N and above) are produced using directional solidification in vacuum, not cast. This process prevents inclusions from entering the metal, enabling us to maintain the highest purities. Cast targets at lower purities (4N) are suitable for applications where trace-level contamination is less critical.
What sizes are available and can you make custom sizes?
Stock sizes range from 1" (25mm) to 12" (305mm) in diameter with thicknesses from 0.125" (3.2mm) to 1" (25.4mm). Larger sizes and custom dimensions are available with short lead times. Contact us with your specifications.
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