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  • High purity copper pellets 6N 99.9999 percent
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High Purity Aluminum

High Purity Copper Pellets - 6N (99.9999%)

High Purity Aluminum| SKU: varies by variant
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$900.00 USD
$900.00 USD
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GDMS COA included with each shipment. Most standard items ship within 1 to 2 business days.

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We are pleased to expand our offerings to include other high purity metals including High Purity Copper Pellets -6N (99.999%). High Purity Copper has excellent conductivity properties and 6N purity is important for producing advanced materials such as semiconductors and superconducting ceramics, among other applications.

Other Copper 6N products are available on custom order basis - disks, rods and plates.  Please feel free to send inquiries to us for quotes.

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Typical Applications

  • Semiconductor metallization and interconnect layers
  • Flat panel display and touch screen coatings
  • Optical coatings and precision mirrors
  • Hard disk drive media
  • Solar cell contacts
  • MEMS and sensor device fabrication
  • Decorative and functional PVD coatings

Send us your target design for a custom quote

Chemical Analysis Contact Us for Custom Sizes
MaterialAluminum (Al)
Purity range4N (99.99%) to 6N (99.9999%)
Alloy optionsAlSi, AlCu, AlCuSi, AlMg, AlMgSi, AlNi, AlNd
Available diameters1" (25mm) to 12" (305mm)
Available thicknesses0.125" (3.2mm) to 1" (25.4mm)
Production methodDirectional solidification in vacuum (5N and above). Cast (4N).
FormsDisk, bonded assemblies, custom shapes
CertificationGDMS COA included with each shipment
Shipping1 to 2 business days (standard US), 2 to 5 days international
Custom ordersCustom sizes, thicknesses, alloys, and bonded assemblies available
What purity sputtering target do I need for semiconductor applications?
For semiconductor metallization and interconnect layers, 5N (99.999%) is the standard choice. For higher-end applications such as superconducting devices or quantum computing, 6N (99.9999%) targets reduce trace metal contamination to levels required by those processes. 4N targets are suitable for general thin-film coating and decorative applications.
Can I get a bonded sputtering target assembly?
Yes. HPA supplies bonded target assemblies designed to match your specific sputtering tool and process requirements. Contact us with your target design, backing plate specifications, and bonding requirements for a custom quote.
What is the difference between cast and directionally solidified targets?
HPA's super high purity targets (5N and above) are produced using directional solidification in vacuum, not cast. This process prevents inclusions from entering the metal, enabling us to maintain the highest purities. Cast targets at lower purities (4N) are suitable for applications where trace-level contamination is less critical.
What sizes are available and can you make custom sizes?
Stock sizes range from 1" (25mm) to 12" (305mm) in diameter with thicknesses from 0.125" (3.2mm) to 1" (25.4mm). Larger sizes and custom dimensions are available with short lead times. Contact us with your specifications.
Technical guide

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