Ultra-Pure Aluminum 6N5 MBE Grade – Highest Purity Source Material for Demanding MBE & UHV Applications
Ultra-pure aluminum 6N5 MBE Grade is HPA’s highest-purity aluminum source material at 99.99995% (6N5), specially developed for molecular beam epitaxy (MBE) and ultra-high-vacuum (UHV) thin film deposition. This grade minimizes trace impurities that can compromise film quality, device performance, and research reproducibility in the most demanding environments.
Sold by sealed glass jar only (we do not break jars). Each pellet is individually packaged in argon-purged glass jars to prevent oxidation and contamination during handling and storage. Every lot includes full GDMS analysis with complete elemental traceability. GDMS COA included with each shipment.
Available Pellet Sizes (priced per sealed glass jar):
- Small Jar: 6 mm diameter × 20 mm length — 1.5 g per pellet, 10 pellets per jar (≈ 15 g total)
- Large Jar: 10 mm diameter × 40 mm length — 8.5 g per pellet, 5 pellets per jar (≈ 42.5 g total)
Typical Applications:
- Molecular beam epitaxy (MBE) source material
- Compound semiconductor growth
- Ultra-high-vacuum (UHV) thin film deposition
- Quantum well and superlattice device fabrication
- High-electron-mobility transistor (HEMT) research
- Advanced photonics and optoelectronics
- University and national laboratory MBE systems
Larger quantities and volume pricing available — contact us for multi-jar orders or custom configurations.
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Typical Applications
- Semiconductor metallization and interconnect layers
- Flat panel display and touch screen coatings
- Optical coatings and precision mirrors
- Hard disk drive media
- Solar cell contacts
- MEMS and sensor device fabrication
- Decorative and functional PVD coatings
Send us your target design for a custom quote
| Material | Aluminum (Al) |
| Purity range | 4N (99.99%) to 6N (99.9999%) |
| Alloy options | AlSi, AlCu, AlCuSi, AlMg, AlMgSi, AlNi, AlNd |
| Available diameters | 1" (25mm) to 12" (305mm) |
| Available thicknesses | 0.125" (3.2mm) to 1" (25.4mm) |
| Production method | Directional solidification in vacuum (5N and above). Cast (4N). |
| Forms | Disk, bonded assemblies, custom shapes |
| Certification | GDMS COA included with each shipment |
| Shipping | 1 to 2 business days (standard US), 2 to 5 days international |
| Custom orders | Custom sizes, thicknesses, alloys, and bonded assemblies available |
What purity sputtering target do I need for semiconductor applications?
Can I get a bonded sputtering target assembly?
What is the difference between cast and directionally solidified targets?
What sizes are available and can you make custom sizes?
All About Aluminum Sputtering Targets
A comprehensive guide to aluminum sputtering target materials, purities, and applications for thin film deposition.
Read article →The Essential Guide to Thin Film Deposition and Vacuum Coating
Understanding PVD, CVD, and vacuum coating processes for metals and how to choose the right source material.
Read article →Aluminum in Superconducting Qubit Fabrication
How high purity aluminum is used in superconducting qubit fabrication, including materials selection, purity requirements, and deposition methods.
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