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High Purity Aluminum - Evaporation Pellets - Slugs

highpurityaluminum - Pellets - Slugs - Shot| SKU: varies by variant
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GDMS COA included with each shipment. Most standard items ship within 1 to 2 business days.

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High purity aluminum pellets and slugs are precision-manufactured cylindrical evaporation sources designed for thermal evaporation, electron-beam evaporation, and other vacuum deposition processes. These sources are produced by electrode cutting of high-purity aluminum rod to create consistent, identical cylindrical geometries that deliver stable melt behavior, reproducible deposition rates, and minimal particulates — critical requirements for thin-film coating and vacuum deposition applications.

Manufacturing & Quality Process
After precision cutting, the pellets and slugs undergo a thorough cleaning process to ensure surface cleanliness and minimize oxidation. The material is first cleaned in a dilute hydrofluoric acid (HF) solution (~2%) to remove surface oxides and contaminants, followed by multiple rinses with deionized (DI) water. The pellets and slugs are then dried under controlled conditions and packaged to maintain cleanliness and minimize re-oxidation prior to use. This process ensures consistent surface quality and reliable performance during evaporation.

Standard Sizes
We maintain strong inventory in the following standard cylindrical sizes:
•    3 mm diameter × 3 mm length (primary stock)
•    3 mm diameter × 6 mm length
•    6 mm diameter × 6 mm length (primary stock)
•    10 mm diameter × 10 mm length (limited stock available)

Smaller sizes (3 × 3 mm and 3 × 6 mm) are particularly well suited for thermal evaporation due to higher surface-to-volume ratio. Larger sizes (6 × 6 mm and 10 × 10 mm) offer greater thermal mass and are preferred for electron-beam evaporation where stable melt pools under high power density are required.

Granules / Shot for Large Commercial Orders
For large-volume commercial applications that do not require consistent sizing or ultra-high purity, we offer 4N (99.99%) aluminum granules/shot, typically sized approximately 0.25" × 0.375" (6 mm × 9 mm). These irregular shapes are more cost-effective for high-volume needs but are generally not recommended for thin-film deposition or other precision vacuum processes due to variable melt behavior and increased potential for particulates.

Typical Applications
•    Semiconductor thin-film metallization
•    Optical coatings (anti-reflection, mirrors, filters)
•    Solar cell metallization and contacts
•    OLED, display, and thin-film electronics manufacturing
•    Quantum device fabrication and superconducting thin films
•    University, national laboratory, and research vacuum deposition systems
•    Electron-beam and thermal evaporation processes requiring high repeatability

Purity & Documentation
Available in purities from 4N (99.99%) to 6N+ (including 6N5 MBE grade). Every shipment includes a GDMS (Glow Discharge Mass Spectrometry) Certificate of Analysis documenting metallic impurity levels.

Availability & Customization
Most standard pellet/slug sizes ship within 1–2 business days. Custom sizes, lengths, and alloy compositions are available upon request to support specialized deposition processes and research requirements.

Related Articles
How to Choose Between 4N, 5N, 5N5 and 6N
Maintaining Purity During Processing and Alloying
COA Explained

Typical Applications

  • Semiconductor metallization and interconnect layers
  • Flat panel display and touch screen coatings
  • Optical coatings and precision mirrors
  • Hard disk drive media
  • Solar cell contacts
  • MEMS and sensor device fabrication
  • Decorative and functional PVD coatings

Send us your target design for a custom quote

MaterialAluminum (Al)
Purity range4N (99.99%) to 6N (99.9999%)
Alloy optionsAlSi, AlCu, AlCuSi, AlMg, AlMgSi, AlNi, AlNd
Available diameters1" (25mm) to 12" (305mm)
Available thicknesses0.125" (3.2mm) to 1" (25.4mm)
Production methodDirectional solidification in vacuum (5N and above). Cast (4N).
FormsDisk, bonded assemblies, custom shapes
CertificationGDMS COA included with each shipment
Shipping1 to 2 business days (standard US), 2 to 5 days international
Custom ordersCustom sizes, thicknesses, alloys, and bonded assemblies available
What purity sputtering target do I need for semiconductor applications?
For semiconductor metallization and interconnect layers, 5N (99.999%) is the standard choice. For higher-end applications such as superconducting devices or quantum computing, 6N (99.9999%) targets reduce trace metal contamination to levels required by those processes. 4N targets are suitable for general thin-film coating and decorative applications.
Can I get a bonded sputtering target assembly?
Yes. HPA supplies bonded target assemblies designed to match your specific sputtering tool and process requirements. Contact us with your target design, backing plate specifications, and bonding requirements for a custom quote.
What is the difference between cast and directionally solidified targets?
HPA's super high purity targets (5N and above) are produced using directional solidification in vacuum, not cast. This process prevents inclusions from entering the metal, enabling us to maintain the highest purities. Cast targets at lower purities (4N) are suitable for applications where trace-level contamination is less critical.
What sizes are available and can you make custom sizes?
Stock sizes range from 1" (25mm) to 12" (305mm) in diameter with thicknesses from 0.125" (3.2mm) to 1" (25.4mm). Larger sizes and custom dimensions are available with short lead times. Contact us with your specifications.
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