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High Purity Aluminum

Aluminum Starter Sources

High Purity Aluminum - Starter Sources| SKU: varies by variant
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$325.00 USD
$325.00 USD
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GDMS COA included with each shipment. Most standard items ship within 1 to 2 business days.

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High purity aluminum starter sources are pre-formed or alloyed evaporation materials designed for thermal evaporation, electron-beam evaporation, and vacuum deposition processes. Their controlled geometry and composition promote stable melting behavior, minimize spitting and fractionation, and support consistent deposition rates with low contamination.

Available in purities from 4N (99.99%) through 6N (99.9999%), including specialty alloy grades such as AlCu1%, these starter sources are used in applications where precise film composition and process stability are required. Additional alloy compositions, including AlSi, AlCuSi, AlMg, AlMgSi, AlNi, and AlNd, may be available. GDMS COA included with each shipment.

Most starter sources are produced to order, with limited standard configurations maintained in stock. Lead times vary depending on alloy, quantity, and current workload. 

Typical Applications:
•    Semiconductor thin film metallization
•    Optical coatings and mirrors
•    Solar cell contacts
•    OLED and display manufacturing
•    Compound semiconductor and quantum device fabrication
•    Electron-beam and thermal evaporation systems
•    University and national laboratory R&D

Related Articles:
All About Aluminum Sputtering Targets
Why Quantum Computing Companies Choose HPA

Typical Applications

  • Semiconductor metallization and interconnect layers
  • Flat panel display and touch screen coatings
  • Optical coatings and precision mirrors
  • Hard disk drive media
  • Solar cell contacts
  • MEMS and sensor device fabrication
  • Decorative and functional PVD coatings

Send us your target design for a custom quote

Typical Chemical Analysis Contact Us for Custom Sizes
MaterialAluminum (Al)
Purity range4N (99.99%) to 6N (99.9999%)
Alloy optionsAlSi, AlCu, AlCuSi, AlMg, AlMgSi, AlNi, AlNd
Available diameters1" (25mm) to 12" (305mm)
Available thicknesses0.125" (3.2mm) to 1" (25.4mm)
Production methodDirectional solidification in vacuum (5N and above). Cast (4N).
FormsDisk, bonded assemblies, custom shapes
CertificationGDMS COA included with each shipment
Shipping1 to 2 business days (standard US), 2 to 5 days international
Custom ordersCustom sizes, thicknesses, alloys, and bonded assemblies available
What purity sputtering target do I need for semiconductor applications?
For semiconductor metallization and interconnect layers, 5N (99.999%) is the standard choice. For higher-end applications such as superconducting devices or quantum computing, 6N (99.9999%) targets reduce trace metal contamination to levels required by those processes. 4N targets are suitable for general thin-film coating and decorative applications.
Can I get a bonded sputtering target assembly?
Yes. HPA supplies bonded target assemblies designed to match your specific sputtering tool and process requirements. Contact us with your target design, backing plate specifications, and bonding requirements for a custom quote.
What is the difference between cast and directionally solidified targets?
HPA's super high purity targets (5N and above) are produced using directional solidification in vacuum, not cast. This process prevents inclusions from entering the metal, enabling us to maintain the highest purities. Cast targets at lower purities (4N) are suitable for applications where trace-level contamination is less critical.
What sizes are available and can you make custom sizes?
Stock sizes range from 1" (25mm) to 12" (305mm) in diameter with thicknesses from 0.125" (3.2mm) to 1" (25.4mm). Larger sizes and custom dimensions are available with short lead times. Contact us with your specifications.
Technical guide

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Quantum applications

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